Kim, B.; Han, S.; Park, S.; Kim, S.; Jung, M.; Park, C.-H.; Jeon, H.-S.; Kim, D.-W.; Han, Y.
Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. Minerals 2021, 11, 1213.
https://doi.org/10.3390/min11111213
AMA Style
Kim B, Han S, Park S, Kim S, Jung M, Park C-H, Jeon H-S, Kim D-W, Han Y.
Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. Minerals. 2021; 11(11):1213.
https://doi.org/10.3390/min11111213
Chicago/Turabian Style
Kim, Boram, Seongsoo Han, Seungsoo Park, Seongmin Kim, Minuk Jung, Chul-Hyun Park, Ho-Seok Jeon, Dae-Weon Kim, and Yosep Han.
2021. "Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas" Minerals 11, no. 11: 1213.
https://doi.org/10.3390/min11111213
APA Style
Kim, B., Han, S., Park, S., Kim, S., Jung, M., Park, C.-H., Jeon, H.-S., Kim, D.-W., & Han, Y.
(2021). Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. Minerals, 11(11), 1213.
https://doi.org/10.3390/min11111213