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Journal: Symmetry, 2023
Volume: 15
Number: 418

Article: The Development and Progress of Multi-Physics Simulation Design for TSV-Based 3D Integrated System
Authors: by Xianglong Wang, Dongdong Chen, Di Li, Chen Kou and Yintang Yang
Link: https://www.mdpi.com/2073-8994/15/2/418

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