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Journal: Symmetry, 2021
Volume: 13
Number: 1771
Article:
Microstrip Impedance Management through Multilayer PCB Stack-Up: Discontinuity Compensation Voids with Asymmetric Dielectrics
Authors:
by
Aleksandr Vasjanov and Vaidotas Barzdenas
Link:
https://www.mdpi.com/2073-8994/13/10/1771
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