Next Article in Journal / Special Issue
A 13C-NMR Study on the 1,3-Dimethylolurea-Phenol Co-Condensation Reaction: A Model for Amino-Phenolic Co-Condensed Resin Synthesis
Previous Article in Journal
Preparation of Magnetic Iron Oxide Nanoparticles (MIONs) with Improved Saturation Magnetization Using Multifunctional Polymer Ligand
Previous Article in Special Issue
Low Density Wood-Based Particleboards Bonded with Foamable Sour Cassava Starch: Preliminary Studies
Article Menu
Issue 11 (November) cover image

Export Article

Open AccessArticle
Polymers 2016, 8(11), 394;

High Bonding Temperatures Greatly Improve Soy Adhesive Wet Strength

Forest Products Laboratory, Madison, WI 53726, USA
AgriChemical Technologies, Mount Horeb, WI 53572, USA
Author to whom correspondence should be addressed.
Academic Editors: Antonio Pizzi and Alexander Böker
Received: 1 August 2016 / Revised: 23 September 2016 / Accepted: 24 October 2016 / Published: 8 November 2016
(This article belongs to the Special Issue Renewable Polymeric Adhesives)
Full-Text   |   PDF [1143 KB, uploaded 8 November 2016]   |  


Soy wood adhesive bond strengths reported in different literature studies are difficult to compare because a variety of temperatures and other conditions have been used for the bonding and testing step. Some reports have indicated bond strengths are sensitive to bonding temperature, but the reason(s) for this has not been intensively investigated. Although these prior studies differ in other ways (such as type of soy, wood species, and test method), the effect of bonding temperature has not been clearly examined, which is important for focusing commercial applications. A tensile shear test using two-parallel-ply veneer specimens with smooth maple was used to measure both the dry and wet cohesive strength of soy adhesives. Although the soy adhesives gave very good strengths and dry wood failure, they often have low wood failure and shear strengths under wet conditions when bonded at 120 °C. However, wet strength greatly increased as the bonding temperature increased (120, 150 and 180 °C) for these two-ply tests with. This study examined the use of different types of soys (flours, concentrates and isolates) and different bonding temperatures and bonding conditions to evacuate several possible mechanisms for this temperature sensitivity, with coalescence being the most likely. View Full-Text
Keywords: soy; flour; concentrate; isolate; wet shear strength; bonding temperature soy; flour; concentrate; isolate; wet shear strength; bonding temperature

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

Share & Cite This Article

MDPI and ACS Style

Frihart, C.R.; Coolidge, T.; Mock, C.; Valle, E. High Bonding Temperatures Greatly Improve Soy Adhesive Wet Strength. Polymers 2016, 8, 394.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics



[Return to top]
Polymers EISSN 2073-4360 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top