Fan, C.; Chen, H.; Lin, F.; Li, W.; Xiong, X.; Chen, B.; Yu, H.
Impact of Curing Time and Temperature on Bond Performance of Epoxy Resin Adhesives for Steel Bridge Decks. Polymers 2025, 17, 1018.
https://doi.org/10.3390/polym17081018
AMA Style
Fan C, Chen H, Lin F, Li W, Xiong X, Chen B, Yu H.
Impact of Curing Time and Temperature on Bond Performance of Epoxy Resin Adhesives for Steel Bridge Decks. Polymers. 2025; 17(8):1018.
https://doi.org/10.3390/polym17081018
Chicago/Turabian Style
Fan, Chuanbin, Huanyong Chen, Feng Lin, Weixiong Li, Xuetang Xiong, Bo Chen, and Huayang Yu.
2025. "Impact of Curing Time and Temperature on Bond Performance of Epoxy Resin Adhesives for Steel Bridge Decks" Polymers 17, no. 8: 1018.
https://doi.org/10.3390/polym17081018
APA Style
Fan, C., Chen, H., Lin, F., Li, W., Xiong, X., Chen, B., & Yu, H.
(2025). Impact of Curing Time and Temperature on Bond Performance of Epoxy Resin Adhesives for Steel Bridge Decks. Polymers, 17(8), 1018.
https://doi.org/10.3390/polym17081018