Videira, P.F.C.; Ferreira, R.A.; Maleki, P.; Akhavan-Safar, A.; Carbas, R.J.C.; Marques, E.A.S.; Karunamurthy, B.; da Silva, L.F.M.
Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in Microchips. Polymers 2025, 17, 520.
https://doi.org/10.3390/polym17040520
AMA Style
Videira PFC, Ferreira RA, Maleki P, Akhavan-Safar A, Carbas RJC, Marques EAS, Karunamurthy B, da Silva LFM.
Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in Microchips. Polymers. 2025; 17(4):520.
https://doi.org/10.3390/polym17040520
Chicago/Turabian Style
Videira, Pedro F. C., Renato A. Ferreira, Payam Maleki, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, and Lucas F. M. da Silva.
2025. "Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in Microchips" Polymers 17, no. 4: 520.
https://doi.org/10.3390/polym17040520
APA Style
Videira, P. F. C., Ferreira, R. A., Maleki, P., Akhavan-Safar, A., Carbas, R. J. C., Marques, E. A. S., Karunamurthy, B., & da Silva, L. F. M.
(2025). Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in Microchips. Polymers, 17(4), 520.
https://doi.org/10.3390/polym17040520
