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Journal: Polymers, 2025
Volume: 17
Number: 2034
2034
Article: Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity
Authors: by Yu-Chi Sung, Chih-Ping Hu, Sheng-Jye Hwang, Ming-Hsien Shih, Wen-Hsiang Liao, Yong-Jie Zeng and Cheng-Tse Tsai
Link: https://www.mdpi.com/2073-4360/17/15/2034

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