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Journal: PolymersVolume: 17Number: 2034
Article: Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity
- Authors:
- Yu-Chi Sung1,
- Chih-Ping Hu1 and
- Sheng-Jye Hwang1,*
- et al.
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