Chen, Z.; Wang, S.; Feng, S.; Huang, Y.; Hu, Y.; Yang, Z.
A Co-Blended and Compounded Photosensitive Resin with Improved Mechanical Properties and Thermal Stability for Nail Polish Application. Polymers 2025, 17, 40.
https://doi.org/10.3390/polym17010040
AMA Style
Chen Z, Wang S, Feng S, Huang Y, Hu Y, Yang Z.
A Co-Blended and Compounded Photosensitive Resin with Improved Mechanical Properties and Thermal Stability for Nail Polish Application. Polymers. 2025; 17(1):40.
https://doi.org/10.3390/polym17010040
Chicago/Turabian Style
Chen, Zhihong, Shengsen Wang, Shengyue Feng, Yingzi Huang, Yang Hu, and Zhuohong Yang.
2025. "A Co-Blended and Compounded Photosensitive Resin with Improved Mechanical Properties and Thermal Stability for Nail Polish Application" Polymers 17, no. 1: 40.
https://doi.org/10.3390/polym17010040
APA Style
Chen, Z., Wang, S., Feng, S., Huang, Y., Hu, Y., & Yang, Z.
(2025). A Co-Blended and Compounded Photosensitive Resin with Improved Mechanical Properties and Thermal Stability for Nail Polish Application. Polymers, 17(1), 40.
https://doi.org/10.3390/polym17010040