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Journal: Polymers, 2024
Volume: 16
Number: 398

Article: Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering
Authors: by Seong-ju Han, Seungyeon Lee and Keon-Soo Jang
Link: https://www.mdpi.com/2073-4360/16/3/398

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