Butsyk, A.; Varava, Y.; Moskalenko, R.; Husak, Y.; Piddubnyi, A.; Denysenko, A.; Korniienko, V.; Ramanaviciute, A.; Banasiuk, R.; Pogorielov, M.;
et al. Copper Nanoparticle Loaded Electrospun Patches for Infected Wound Treatment: From Development to In-Vivo Application. Polymers 2024, 16, 2733.
https://doi.org/10.3390/polym16192733
AMA Style
Butsyk A, Varava Y, Moskalenko R, Husak Y, Piddubnyi A, Denysenko A, Korniienko V, Ramanaviciute A, Banasiuk R, Pogorielov M,
et al. Copper Nanoparticle Loaded Electrospun Patches for Infected Wound Treatment: From Development to In-Vivo Application. Polymers. 2024; 16(19):2733.
https://doi.org/10.3390/polym16192733
Chicago/Turabian Style
Butsyk, Anna, Yulia Varava, Roman Moskalenko, Yevheniia Husak, Artem Piddubnyi, Anastasiia Denysenko, Valeriia Korniienko, Agne Ramanaviciute, Rafal Banasiuk, Maksym Pogorielov,
and et al. 2024. "Copper Nanoparticle Loaded Electrospun Patches for Infected Wound Treatment: From Development to In-Vivo Application" Polymers 16, no. 19: 2733.
https://doi.org/10.3390/polym16192733
APA Style
Butsyk, A., Varava, Y., Moskalenko, R., Husak, Y., Piddubnyi, A., Denysenko, A., Korniienko, V., Ramanaviciute, A., Banasiuk, R., Pogorielov, M., Ramanavicius, A., & Korniienko, V.
(2024). Copper Nanoparticle Loaded Electrospun Patches for Infected Wound Treatment: From Development to In-Vivo Application. Polymers, 16(19), 2733.
https://doi.org/10.3390/polym16192733
