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Journal: Polymers, 2023
Volume: 15
Number: 4264

Article: Introduction of Nanoscale Si3N4 to Improve the Dielectric Thermal Stability of a Si3N4/P(VDF-HFP) Composite Film
Authors: by Jing Guan, Laifei Cheng and Ye Fang
Link: https://www.mdpi.com/2073-4360/15/21/4264

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