Zhang, P.; Xue, S.; Liu, L.; Wu, J.; Luo, Q.; Wang, J.
Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin. Polymers 2022, 14, 5303.
https://doi.org/10.3390/polym14235303
AMA Style
Zhang P, Xue S, Liu L, Wu J, Luo Q, Wang J.
Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin. Polymers. 2022; 14(23):5303.
https://doi.org/10.3390/polym14235303
Chicago/Turabian Style
Zhang, Peng, Songbai Xue, Lu Liu, Jie Wu, Qingcheng Luo, and Jianhao Wang.
2022. "Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin" Polymers 14, no. 23: 5303.
https://doi.org/10.3390/polym14235303
APA Style
Zhang, P., Xue, S., Liu, L., Wu, J., Luo, Q., & Wang, J.
(2022). Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin. Polymers, 14(23), 5303.
https://doi.org/10.3390/polym14235303