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Polymers
Volume 14
Issue 2
10.3390/polym14020258
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Article

Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes

by
Kyung-Soo Sung
1,
So-Yeon Kim
1,
Min-Keun Oh
2 and
Namil Kim
2,*
1
Research & Development Center, Protavic Korea, Daejeon 34326, Korea
2
Energy Materials R&D Center, Korea Automotive Technology Institute, Cheonan-si 31214, Korea
*
Author to whom correspondence should be addressed.
Polymers 2022, 14(2), 258; https://doi.org/10.3390/polym14020258
Submission received: 6 December 2021 / Revised: 3 January 2022 / Accepted: 5 January 2022 / Published: 8 January 2022
(This article belongs to the Special Issue Smart Composites and Processing)
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Abstract

Thermally conductive adhesives were prepared by incorporating magnesium oxide (MgO) and boron nitride (BN) into fluorosilicone resins. The effects of filler type, size, and shape on thermal conductivity and adhesion properties were analyzed. Higher thermal conductivity was achieved when larger fillers were used, but smaller ones were advantageous in terms of adhesion strength. Bimodal adhesives containing spherical MgOs with an average particle size of 120 μm and 90 μm exhibited the highest conductivity value of up to 1.82 W/mK. Filler shape was also important to improve the thermal conductivity as the filler type increased. Trimodal adhesives revealed high adhesion strength compared to unimodal and bimodal adhesives, which remained high after aging at 85 °C and 85% relative humidity for 168 h. It was found that the thermal and adhesion properties of fluorosilicone composites were strongly affected by the packing efficiency and interfacial resistance of the particles.
Keywords: adhesive; fluorosilicone; thermal conductivity; magnesium oxide; boron nitride adhesive; fluorosilicone; thermal conductivity; magnesium oxide; boron nitride
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MDPI and ACS Style

Sung, K.-S.; Kim, S.-Y.; Oh, M.-K.; Kim, N. Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes. Polymers 2022, 14, 258. https://doi.org/10.3390/polym14020258

AMA Style

Sung K-S, Kim S-Y, Oh M-K, Kim N. Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes. Polymers. 2022; 14(2):258. https://doi.org/10.3390/polym14020258

Chicago/Turabian Style

Sung, Kyung-Soo, So-Yeon Kim, Min-Keun Oh, and Namil Kim. 2022. "Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes" Polymers 14, no. 2: 258. https://doi.org/10.3390/polym14020258

APA Style

Sung, K.-S., Kim, S.-Y., Oh, M.-K., & Kim, N. (2022). Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes. Polymers, 14(2), 258. https://doi.org/10.3390/polym14020258

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