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Article

Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation

by 1, 1,2,*, 1 and 1
1
College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
2
Key Laboratory of Engineering Dielectric and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150040, China
*
Author to whom correspondence should be addressed.
Academic Editor: Horacio Salavagione
Polymers 2021, 13(24), 4417; https://doi.org/10.3390/polym13244417
Received: 17 November 2021 / Revised: 2 December 2021 / Accepted: 9 December 2021 / Published: 16 December 2021
(This article belongs to the Section Polymer Composites and Nanocomposites)
To promote the construction of the thermal network in the epoxy resin (EP), a certain proportion of silver nanowires (AgNWs) coupled with the hexagonal boron nitride (BN) nanoplates were chosen as fillers to improve the thermal conductivity of EP resin. Before preparing the composites, BN was treated by silane coupling agent 3-aminopropyltriethoxysilane (KH550), and AgNWs was coated by dopamine hydrochloride. The BN/AgNWs/EP composites were prepared after curing, and the thermal conductivity and dielectric properties of the composites was tested. Results showed that the AgNWs and BN were uniformly dispersed in epoxy resin. It synergistically built a thermal network and greatly increased the thermal conductivity of the composites, which increased 9% after adding AgNWs. Moreover, the electrical property test showed that the addition of AgNWs had little effect on the dielectric constant and dielectric loss of the composites, indicating a rather good electrical insulation of the composites. View Full-Text
Keywords: epoxy resin; boron nitride; silver nanowires; thermal conductivity epoxy resin; boron nitride; silver nanowires; thermal conductivity
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MDPI and ACS Style

Li, X.; Weng, L.; Wang, H.; Wang, X. Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation. Polymers 2021, 13, 4417. https://doi.org/10.3390/polym13244417

AMA Style

Li X, Weng L, Wang H, Wang X. Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation. Polymers. 2021; 13(24):4417. https://doi.org/10.3390/polym13244417

Chicago/Turabian Style

Li, Xue, Ling Weng, Hebing Wang, and Xiaoming Wang. 2021. "Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation" Polymers 13, no. 24: 4417. https://doi.org/10.3390/polym13244417

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