Shin, N.;                     Shin, H.J.;                     Yi, Y.;                     Beom, J.;                     Lee, W.;                     Lee, C.-H.;                     Kim, D.W.    
        p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation. Polymers 2020, 12, 1014.
    https://doi.org/10.3390/polym12051014
    AMA Style
    
                                Shin N,                                 Shin HJ,                                 Yi Y,                                 Beom J,                                 Lee W,                                 Lee C-H,                                 Kim DW.        
                p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation. Polymers. 2020; 12(5):1014.
        https://doi.org/10.3390/polym12051014
    
    Chicago/Turabian Style
    
                                Shin, Nara,                                 Hyo Jung Shin,                                 Yoonyoung Yi,                                 Jaewon Beom,                                 Wonhyung Lee,                                 Choong-Hyun Lee,                                 and Dong Woon Kim.        
                2020. "p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation" Polymers 12, no. 5: 1014.
        https://doi.org/10.3390/polym12051014
    
    APA Style
    
                                Shin, N.,                                 Shin, H. J.,                                 Yi, Y.,                                 Beom, J.,                                 Lee, W.,                                 Lee, C.-H.,                                 & Kim, D. W.        
        
        (2020). p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation. Polymers, 12(5), 1014.
        https://doi.org/10.3390/polym12051014