Shin, N.; Shin, H.J.; Yi, Y.; Beom, J.; Lee, W.; Lee, C.-H.; Kim, D.W.
p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation. Polymers 2020, 12, 1014.
https://doi.org/10.3390/polym12051014
AMA Style
Shin N, Shin HJ, Yi Y, Beom J, Lee W, Lee C-H, Kim DW.
p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation. Polymers. 2020; 12(5):1014.
https://doi.org/10.3390/polym12051014
Chicago/Turabian Style
Shin, Nara, Hyo Jung Shin, Yoonyoung Yi, Jaewon Beom, Wonhyung Lee, Choong-Hyun Lee, and Dong Woon Kim.
2020. "p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation" Polymers 12, no. 5: 1014.
https://doi.org/10.3390/polym12051014
APA Style
Shin, N., Shin, H. J., Yi, Y., Beom, J., Lee, W., Lee, C.-H., & Kim, D. W.
(2020). p66shc siRNA-Encapsulated PLGA Nanoparticles Ameliorate Neuropathic Pain Following Spinal Nerve Ligation. Polymers, 12(5), 1014.
https://doi.org/10.3390/polym12051014