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Journal: Polymers, 2019
Volume: 11
Number: 1444

Article: Harnessing the Topography of 3D Spongy-Like Electrospun Bundled Fibrous Scaffold via a Sharply Inclined Array Collector
Authors: by Sun Hee Cho, Jeong In Kim, Cheol Sang Kim, Chan Hee Park and In Gi Kim
Link: https://www.mdpi.com/2073-4360/11/9/1444

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