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Journal: Polymers, 2019
Volume: 11
Number: 2055
2055
Article: Enhancement of Solvent Resistance of Polyimide Electrospun Mat via the UV-Assisted Electrospinning and Photosensitive Varnish
Authors: by Lin Qi, Chen-Yu Guo, Meng-Ge Huang Fu, Yan Zhang, Lu-meng Yin, Lin Wu, Jin-gang Liu and Xiu-min Zhang
Link: https://www.mdpi.com/2073-4360/11/12/2055

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