A High-Performance and Low-Cost Soy Flour Adhesive with a Hydroxymethyl Melamine Prepolymer
1
Key Laboratory of Wood Material Science and Utilization, Beijing Forestry University, Beijing 100083, China
2
Beijing Key Laboratory of Wood Science and Engineering, Ministry of Education, College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China
*
Authors to whom correspondence should be addressed.
Polymers 2018, 10(8), 909; https://doi.org/10.3390/polym10080909
Received: 4 July 2018
/
Revised: 2 August 2018
/
Accepted: 8 August 2018
/
Published: 13 August 2018
To improve the performance of a soy flour (SF)-based adhesive, a low-cost hydroxymethyl melamine prepolymer (HMP) was synthesized and then used to modify the SF-based adhesive. The HMP was characterized, and the performance of the adhesive was evaluated, including its residual rate, functions, thermal stability, and fracture section. Plywood was fabricated to measure wet shear strength. The results indicated that the HMP preferentially reacted with polysaccharose in SF and formed a cross-linking network to improve the water resistance of the adhesive. This polysaccharose-based network also combined with the HMP self-polycondensation network and soy protein to form an interpenetrating network, which further improved the water resistance of the adhesive. With the addition of 9% HMP, the wet shear strength (63 °C) of the plywood was 1.21 MPa, which was 9.3 times that of the SF adhesive. With the HMP additive increased to 15%, the shear strength (100 °C) of the plywood was 0.79 MPa, which met the plywood requirement for exterior use (≥0.7 MPa) in accordance with Chinese National Standard (GB/T 9846.3-2004). With the addition of 9% and 15% HMP, the residual rates of the adhesive improved by 5.1% and 8.5%, respectively. The dense interpenetrating network structure improved the thermal stability of the resultant adhesive and created a compact fracture to prevent moisture intrusion, which further increased the water resistance of the adhesive.
View Full-Text
Keywords:
soy flour adhesive; hydroxymethyl melamine prepolymer; polysaccharose; interpenetrating network structure; water resistance
▼
Show Figures
Graphical abstract
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
MDPI and ACS Style
Zhang, M.; Zhang, Y.; Chen, M.; Gao, Q.; Li, J. A High-Performance and Low-Cost Soy Flour Adhesive with a Hydroxymethyl Melamine Prepolymer. Polymers 2018, 10, 909. https://doi.org/10.3390/polym10080909
AMA Style
Zhang M, Zhang Y, Chen M, Gao Q, Li J. A High-Performance and Low-Cost Soy Flour Adhesive with a Hydroxymethyl Melamine Prepolymer. Polymers. 2018; 10(8):909. https://doi.org/10.3390/polym10080909
Chicago/Turabian StyleZhang, Meng, Yi Zhang, Mingsong Chen, Qiang Gao, and Jianzhang Li. 2018. "A High-Performance and Low-Cost Soy Flour Adhesive with a Hydroxymethyl Melamine Prepolymer" Polymers 10, no. 8: 909. https://doi.org/10.3390/polym10080909
Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
