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Journal: Crystals, 2026
Volume: 16
Number: 353
353
Article: Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding
Authors: by Xingwen Qin, Dongxian Yin, Zibo Yu, Hongbo Qin, Haidong Yan, Junke Wu, Jian Li and Siliang He
Link: https://www.mdpi.com/2073-4352/16/5/353

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