Qin, X.; Yin, D.; Yu, Z.; Qin, H.; Yan, H.; Wu, J.; Li, J.; He, S.
Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding. Crystals 2026, 16, 353.
https://doi.org/10.3390/cryst16050353
AMA Style
Qin X, Yin D, Yu Z, Qin H, Yan H, Wu J, Li J, He S.
Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding. Crystals. 2026; 16(5):353.
https://doi.org/10.3390/cryst16050353
Chicago/Turabian Style
Qin, Xingwen, Dongxian Yin, Zibo Yu, Hongbo Qin, Haidong Yan, Junke Wu, Jian Li, and Siliang He.
2026. "Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding" Crystals 16, no. 5: 353.
https://doi.org/10.3390/cryst16050353
APA Style
Qin, X., Yin, D., Yu, Z., Qin, H., Yan, H., Wu, J., Li, J., & He, S.
(2026). Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding. Crystals, 16(5), 353.
https://doi.org/10.3390/cryst16050353