Study on the Machining Characteristics and Thermal Effects of RF Ion Beam Processing of KDP Crystals

To address the issues of heat accumulation and potential thermal damage during radio-frequency (RF) ion beam machining of KDP crystals, an energy deposition model and a temperature field model were developed based on Sigmund’s sputtering theory, a Gaussian beam distribution model, and heat conduction theory. Combined with the Monte Carlo method, the effects of incident energy, incident angle, and ion species on the disturbed layer depth and sputtering yield were systematically investigated. Furthermore, the influences of beam divergence angle and deflection angle on the surface energy deposition density distribution were analyzed. On this basis, the evolution of the temperature field and thermal stress field in KDP crystals under both stationary and linearly moving Gaussian surface heat sources was numerically simulated. The results indicate that the proposed model can effectively characterize the thermal response during ion beam machining of KDP crystals. The disturbed layer depth, sputtering yield, and energy deposition density distribution exhibit pronounced sensitivity to processing parameters. Under a stationary heat source, significant local heat accumulation and stress concentration tend to occur on the material surface. In contrast, a moving heat source can mitigate excessive temperature rise at a single location to some extent, although it also produces a heat-affected zone extending along the scanning path. These findings provide a theoretical basis for the optimization of low-damage RF ion beam machining parameters for KDP crystals.