Order Article Reprints

He X, Zhang Q, Cui Q, Bai Y, Fu L, Zhao Z, Zou C, Wang Y. Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints. Crystals. 2025; 15(6):516. https://doi.org/10.3390/cryst15060516

He, Xinyuan, Qi Zhang, Qiming Cui, Yifan Bai, Lincheng Fu, Zicong Zhao, Chuanhang Zou, and Yong Wang. 2025. "Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints" Crystals 15, no. 6: 516. https://doi.org/10.3390/cryst15060516

He, X., Zhang, Q., Cui, Q., Bai, Y., Fu, L., Zhao, Z., Zou, C., & Wang, Y. (2025). Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints. Crystals, 15(6), 516. https://doi.org/10.3390/cryst15060516