Tian, Y.; Jian, X.; Zhao, M.; Liu, J.; Dai, X.; Zhou, B.; Yang, X.
Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints. Crystals 2023, 13, 1630.
https://doi.org/10.3390/cryst13121630
AMA Style
Tian Y, Jian X, Zhao M, Liu J, Dai X, Zhou B, Yang X.
Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints. Crystals. 2023; 13(12):1630.
https://doi.org/10.3390/cryst13121630
Chicago/Turabian Style
Tian, Yangning, Xiaodong Jian, Mingrui Zhao, Jiahao Liu, Xuanjun Dai, Bin Zhou, and Xiaofeng Yang.
2023. "Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints" Crystals 13, no. 12: 1630.
https://doi.org/10.3390/cryst13121630
APA Style
Tian, Y., Jian, X., Zhao, M., Liu, J., Dai, X., Zhou, B., & Yang, X.
(2023). Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints. Crystals, 13(12), 1630.
https://doi.org/10.3390/cryst13121630