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Journal: Crystals, 2023
Volume: 13
Number: 15

Article: Influence of Surface Preprocessing on 4H-SiC Wafer Slicing by Using Ultrafast Laser
Authors: by Hanwen Wang, Qiu Chen, Yongping Yao, Linlin Che, Baitao Zhang, Hongkun Nie and Rongkun Wang
Link: https://www.mdpi.com/2073-4352/13/1/15

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