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Journal: Micromachines, 2025
Volume: 16
Number: 1155
Article:
Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages
Authors:
by
Dinesh Kumar Kumaravel, Shinoj Sridharan Nair, Khanh Tuyet Anh Tran, Pavan Ahluwalia, Kevin Antony Jesu Durai and Oliver Chyan
Link:
https://www.mdpi.com/2072-666X/16/10/1155
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