Kumaravel, D.K.; Sridharan Nair, S.; Tran, K.T.A.; Ahluwalia, P.; Antony Jesu Durai, K.; Chyan, O.
Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages. Micromachines 2025, 16, 1155.
https://doi.org/10.3390/mi16101155
AMA Style
Kumaravel DK, Sridharan Nair S, Tran KTA, Ahluwalia P, Antony Jesu Durai K, Chyan O.
Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages. Micromachines. 2025; 16(10):1155.
https://doi.org/10.3390/mi16101155
Chicago/Turabian Style
Kumaravel, Dinesh Kumar, Shinoj Sridharan Nair, Khanh Tuyet Anh Tran, Pavan Ahluwalia, Kevin Antony Jesu Durai, and Oliver Chyan.
2025. "Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages" Micromachines 16, no. 10: 1155.
https://doi.org/10.3390/mi16101155
APA Style
Kumaravel, D. K., Sridharan Nair, S., Tran, K. T. A., Ahluwalia, P., Antony Jesu Durai, K., & Chyan, O.
(2025). Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages. Micromachines, 16(10), 1155.
https://doi.org/10.3390/mi16101155
