Scholvin, J.; Zorzos, A.; Kinney, J.; Bernstein, J.; Moore-Kochlacs, C.; Kopell, N.; Fonstad, C.; Boyden, E.S.
Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating. Micromachines 2018, 9, 436.
https://doi.org/10.3390/mi9090436
AMA Style
Scholvin J, Zorzos A, Kinney J, Bernstein J, Moore-Kochlacs C, Kopell N, Fonstad C, Boyden ES.
Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating. Micromachines. 2018; 9(9):436.
https://doi.org/10.3390/mi9090436
Chicago/Turabian Style
Scholvin, Jörg, Anthony Zorzos, Justin Kinney, Jacob Bernstein, Caroline Moore-Kochlacs, Nancy Kopell, Clifton Fonstad, and Edward S. Boyden.
2018. "Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating" Micromachines 9, no. 9: 436.
https://doi.org/10.3390/mi9090436
APA Style
Scholvin, J., Zorzos, A., Kinney, J., Bernstein, J., Moore-Kochlacs, C., Kopell, N., Fonstad, C., & Boyden, E. S.
(2018). Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating. Micromachines, 9(9), 436.
https://doi.org/10.3390/mi9090436