Next Article in Journal
Custom-Designed Glassy Carbon Tips for Atomic Force Microscopy
Next Article in Special Issue
Milling Positive Master for Polydimethylsiloxane Microfluidic Devices: The Microfabrication and Roughness Issues
Previous Article in Journal
Progress in Research of Flexible MEMS Microelectrodes for Neural Interface
Open AccessArticle

PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices

by In-Hyouk Song 1,* and Taehyun Park 2,*
1
Department of Engineering Technology, Texas State University, San Marcos, TX 78666, USA
2
School of Mechanical Engineering, Kyungnam University, Changwon 51767, Korea
*
Authors to whom correspondence should be addressed.
Micromachines 2017, 8(9), 284; https://doi.org/10.3390/mi8090284
Received: 29 August 2017 / Revised: 15 September 2017 / Accepted: 17 September 2017 / Published: 20 September 2017
(This article belongs to the Special Issue Polymer Based MEMS and Microfabrication)
Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers—PMMA to polycarbonate (PC)—to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection. View Full-Text
Keywords: polymethyl methacrylate (PMMA) spin coated polycarbonate (PC); microfluidic; hybrid bonding; thermal bonding; PMMA–PC bonding polymethyl methacrylate (PMMA) spin coated polycarbonate (PC); microfluidic; hybrid bonding; thermal bonding; PMMA–PC bonding
Show Figures

Figure 1

MDPI and ACS Style

Song, I.-H.; Park, T. PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices. Micromachines 2017, 8, 284.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Search more from Scilit
 
Search
Back to TopTop