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MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope

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Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
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Department of Fundamental Sciences, Chinese People’s Armed Police Force Academy, Langfang 065000, China
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Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
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College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
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School of Mechanical and Chemical Engineering, The University of Western Australia, Crawley 6009, WA, Australia
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State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310008, China
*
Authors to whom correspondence should be addressed.
Academic Editor: Ha Duong Ngo
Micromachines 2017, 8(2), 31; https://doi.org/10.3390/mi8020031
Received: 26 November 2016 / Revised: 29 December 2016 / Accepted: 17 January 2017 / Published: 24 January 2017
In this work, we designed a micro-electromechanical systems (MEMS) device that allows simultaneous direct measurement of mechanical properties during deformation under external stress and characterization of the evolution of nanomaterial microstructure within a transmission electron microscope. This MEMS device makes it easy to establish the correlation between microstructure and mechanical properties of nanomaterials. The device uses piezoresistive sensors to measure the force and displacement of nanomaterials qualitatively, e.g., in wire and thin plate forms. The device has a theoretical displacement resolution of 0.19 nm and a force resolution of 2.1 μN. The device has a theoretical displacement range limit of 5.47 μm and a load range limit of 55.0 mN. View Full-Text
Keywords: piezoresistive sensor; electron microscope; in situ mechanical test piezoresistive sensor; electron microscope; in situ mechanical test
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MDPI and ACS Style

Wang, X.; Mao, S.; Zhang, J.; Li, Z.; Deng, Q.; Ning, J.; Yang, X.; Wang, L.; Ji, Y.; Li, X.; Liu, Y.; Zhang, Z.; Han, X. MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope. Micromachines 2017, 8, 31. https://doi.org/10.3390/mi8020031

AMA Style

Wang X, Mao S, Zhang J, Li Z, Deng Q, Ning J, Yang X, Wang L, Ji Y, Li X, Liu Y, Zhang Z, Han X. MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope. Micromachines. 2017; 8(2):31. https://doi.org/10.3390/mi8020031

Chicago/Turabian Style

Wang, Xiaodong, Shengcheng Mao, Jianfei Zhang, Zhipeng Li, Qingsong Deng, Jin Ning, Xudong Yang, Li Wang, Yuan Ji, Xiaochen Li, Yinong Liu, Ze Zhang, and Xiaodong Han. 2017. "MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope" Micromachines 8, no. 2: 31. https://doi.org/10.3390/mi8020031

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