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Journal: Micromachines, 2016
Volume: 7
Number: 234
234
Article: Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding
Authors: by Koki Tanaka, Wei-Shan Wang, Mario Baum, Joerg Froemel, Hideki Hirano, Shuji Tanaka, Maik Wiemer and Thomas Otto
Link: https://www.mdpi.com/2072-666X/7/12/234

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