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Journal: Micromachines, 2016
Volume: 7
Number: 226
Article:
Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding
Authors:
by
Xiaoqing Wang, Yude Yu and Jin Ning
Link:
https://www.mdpi.com/2072-666X/7/12/226
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