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Journal: Micromachines, 2016
Volume: 7
Number: 192

Article: Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Authors: by Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke and Frank Niklaus
Link: https://www.mdpi.com/2072-666X/7/10/192

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