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Journal: Micromachines, 2014
Volume: 5
Number: 783
Article:
Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems
Authors:
by
Florian Thoma, Frank Goldschmidtböing, Keith Cobry and Peter Woias
Link:
https://www.mdpi.com/2072-666X/5/3/783
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