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Journal: Micromachines, 2014
Volume: 5
Number: 783

Article: Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems
Authors: by Florian Thoma, Frank Goldschmidtböing, Keith Cobry and Peter Woias
Link: https://www.mdpi.com/2072-666X/5/3/783

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