Xiao, Y.; Bai, Y.; He, X.; Cui, Q.; Cheng, L.; Yang, R.; Zhang, Q.; Wang, Y.
Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints. Micromachines 2026, 17, 1034.
https://doi.org/10.3390/mi17091034
AMA Style
Xiao Y, Bai Y, He X, Cui Q, Cheng L, Yang R, Zhang Q, Wang Y.
Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints. Micromachines. 2026; 17(9):1034.
https://doi.org/10.3390/mi17091034
Chicago/Turabian Style
Xiao, Yang, Yifan Bai, Xinyuan He, Qiming Cui, Lijuan Cheng, Rui Yang, Qi Zhang, and Yong Wang.
2026. "Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints" Micromachines 17, no. 9: 1034.
https://doi.org/10.3390/mi17091034
APA Style
Xiao, Y., Bai, Y., He, X., Cui, Q., Cheng, L., Yang, R., Zhang, Q., & Wang, Y.
(2026). Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints. Micromachines, 17(9), 1034.
https://doi.org/10.3390/mi17091034
