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Journal: Micromachines, 2026
Volume: 17
Number: 974
974
Article: Impact of Printed Circuit Board Dielectric Material on the Thermal Behavior of Wafer-Level Packaging GaN Transistors Used in High-Power-Density Converters for Electric Vehicle Applications
Authors: by Mohamed Belguith, Sonia Eloued, Moncef Kadi, Jaleleddine Ben Hadj Slama and Mahmoud Hamouda
Link: https://www.mdpi.com/2072-666X/17/8/974

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