Belguith, M.; Eloued, S.; Kadi, M.; Ben Hadj Slama, J.; Hamouda, M.
Impact of Printed Circuit Board Dielectric Material on the Thermal Behavior of Wafer-Level Packaging GaN Transistors Used in High-Power-Density Converters for Electric Vehicle Applications. Micromachines 2026, 17, 974.
https://doi.org/10.3390/mi17080974
AMA Style
Belguith M, Eloued S, Kadi M, Ben Hadj Slama J, Hamouda M.
Impact of Printed Circuit Board Dielectric Material on the Thermal Behavior of Wafer-Level Packaging GaN Transistors Used in High-Power-Density Converters for Electric Vehicle Applications. Micromachines. 2026; 17(8):974.
https://doi.org/10.3390/mi17080974
Chicago/Turabian Style
Belguith, Mohamed, Sonia Eloued, Moncef Kadi, Jaleleddine Ben Hadj Slama, and Mahmoud Hamouda.
2026. "Impact of Printed Circuit Board Dielectric Material on the Thermal Behavior of Wafer-Level Packaging GaN Transistors Used in High-Power-Density Converters for Electric Vehicle Applications" Micromachines 17, no. 8: 974.
https://doi.org/10.3390/mi17080974
APA Style
Belguith, M., Eloued, S., Kadi, M., Ben Hadj Slama, J., & Hamouda, M.
(2026). Impact of Printed Circuit Board Dielectric Material on the Thermal Behavior of Wafer-Level Packaging GaN Transistors Used in High-Power-Density Converters for Electric Vehicle Applications. Micromachines, 17(8), 974.
https://doi.org/10.3390/mi17080974
