Mei, C.; Zheng, T.; Ding, Z.; Zhang, D.; Xu, Y.; Zhao, H.; Chang, L.; Hu, Q.; Xia, C.; Liu, S.;
et al. A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics. Micromachines 2026, 17, 625.
https://doi.org/10.3390/mi17050625
AMA Style
Mei C, Zheng T, Ding Z, Zhang D, Xu Y, Zhao H, Chang L, Hu Q, Xia C, Liu S,
et al. A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics. Micromachines. 2026; 17(5):625.
https://doi.org/10.3390/mi17050625
Chicago/Turabian Style
Mei, Cong, Tianze Zheng, Ziyang Ding, Dan Zhang, Yuan Xu, Huiyao Zhao, Liu Chang, Qiuhan Hu, Chenhui Xia, Shuli Liu,
and et al. 2026. "A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics" Micromachines 17, no. 5: 625.
https://doi.org/10.3390/mi17050625
APA Style
Mei, C., Zheng, T., Ding, Z., Zhang, D., Xu, Y., Zhao, H., Chang, L., Hu, Q., Xia, C., Liu, S., & Li, L.
(2026). A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics. Micromachines, 17(5), 625.
https://doi.org/10.3390/mi17050625
