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Journal: Micromachines, 2026
Volume: 17
Number: 334

Article: Tantalum Interconnect Metallization for Thin-Film Neural Interface Devices
Authors: by Justin R. Abbott, Yupeng Wu, Zachariah M. Campanini, Alexandra Joshi-Imre, Felix Deku and Stuart F. Cogan
Link: https://www.mdpi.com/2072-666X/17/3/334

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