Universal Parafilm®-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates
Abstract
1. Introduction
2. Materials and Methods
2.1. Reagents and Instruments
2.2. Fabrication of Gold Leaf Electrodes
2.3. Electrochemical Evaluation of Gold Leaf Electrodes
2.4. Fabrication and Characterization of Microfluidic–Electrochemical Hybrids
3. Results and Discussion
3.1. Fabrication and Characterization of Laser-Patterned Gold Leaf
3.2. Electrochemical Characterization of Gold Leaf Electrodes
3.3. Voltammetric Characterization of Gold Leaf Electrodes Using UA
3.4. Multi-Substrate Fabrication of Gold Leaf Electrodes and Microfluidic Devices
4. Conclusions
Supplementary Materials
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Yang, Z.; Lou, Y.; Chen, S.; Chen, Y.; Sun, L.; Tian, J.; Cao, R. Universal Parafilm®-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates. Micromachines 2026, 17, 1136. https://doi.org/10.3390/mi17101136
Yang Z, Lou Y, Chen S, Chen Y, Sun L, Tian J, Cao R. Universal Parafilm®-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates. Micromachines. 2026; 17(10):1136. https://doi.org/10.3390/mi17101136
Chicago/Turabian StyleYang, Zhiyuan, Yafei Lou, Siyu Chen, Yongye Chen, Linan Sun, Junfei Tian, and Rong Cao. 2026. "Universal Parafilm®-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates" Micromachines 17, no. 10: 1136. https://doi.org/10.3390/mi17101136
APA StyleYang, Z., Lou, Y., Chen, S., Chen, Y., Sun, L., Tian, J., & Cao, R. (2026). Universal Parafilm®-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates. Micromachines, 17(10), 1136. https://doi.org/10.3390/mi17101136
