Lee, J.; Ju, Y.; Lim, J.; Hong, S.; Baek, S.-W.; Lee, J.
Enhancing Confidence and Interpretability of a CNN-Based Wafer Defect Classification Model Using Temperature Scaling and LIME. Micromachines 2025, 16, 1057.
https://doi.org/10.3390/mi16091057
AMA Style
Lee J, Ju Y, Lim J, Hong S, Baek S-W, Lee J.
Enhancing Confidence and Interpretability of a CNN-Based Wafer Defect Classification Model Using Temperature Scaling and LIME. Micromachines. 2025; 16(9):1057.
https://doi.org/10.3390/mi16091057
Chicago/Turabian Style
Lee, Jieun, Yeonwoo Ju, Junho Lim, Sungmin Hong, Soo-Whang Baek, and Jonghwan Lee.
2025. "Enhancing Confidence and Interpretability of a CNN-Based Wafer Defect Classification Model Using Temperature Scaling and LIME" Micromachines 16, no. 9: 1057.
https://doi.org/10.3390/mi16091057
APA Style
Lee, J., Ju, Y., Lim, J., Hong, S., Baek, S.-W., & Lee, J.
(2025). Enhancing Confidence and Interpretability of a CNN-Based Wafer Defect Classification Model Using Temperature Scaling and LIME. Micromachines, 16(9), 1057.
https://doi.org/10.3390/mi16091057