Liu, J.; Ma, Z.; Yan, Y.; Yuan, D.; Wang, Y.
Study on the Low-Damage Material Removal Mechanism of Silicon Carbide Ceramics Under Longitudinal–Torsional Ultrasonic Grinding Conditions. Micromachines 2025, 16, 1048.
https://doi.org/10.3390/mi16091048
AMA Style
Liu J, Ma Z, Yan Y, Yuan D, Wang Y.
Study on the Low-Damage Material Removal Mechanism of Silicon Carbide Ceramics Under Longitudinal–Torsional Ultrasonic Grinding Conditions. Micromachines. 2025; 16(9):1048.
https://doi.org/10.3390/mi16091048
Chicago/Turabian Style
Liu, Junli, Zhenqi Ma, Yanyan Yan, Dengke Yuan, and Yifan Wang.
2025. "Study on the Low-Damage Material Removal Mechanism of Silicon Carbide Ceramics Under Longitudinal–Torsional Ultrasonic Grinding Conditions" Micromachines 16, no. 9: 1048.
https://doi.org/10.3390/mi16091048
APA Style
Liu, J., Ma, Z., Yan, Y., Yuan, D., & Wang, Y.
(2025). Study on the Low-Damage Material Removal Mechanism of Silicon Carbide Ceramics Under Longitudinal–Torsional Ultrasonic Grinding Conditions. Micromachines, 16(9), 1048.
https://doi.org/10.3390/mi16091048