Article Versions Notes

Qin T, Yang W, Wei Q, Cen Z, Chen J, Xie Y, Tang H, Yang D. Investigation on the Interfacial Delamination of Glass Substrate Packaging Using Cohesive Zone Models. Micromachines. 2025; 16(8):944. https://doi.org/10.3390/mi16080944

Qin, Tianzuo, Wen Yang, Qiqin Wei, Zhangsen Cen, Jianquan Chen, Yi Xie, Huiping Tang, and Daoguo Yang. 2025. "Investigation on the Interfacial Delamination of Glass Substrate Packaging Using Cohesive Zone Models" Micromachines 16, no. 8: 944. https://doi.org/10.3390/mi16080944

Qin, T., Yang, W., Wei, Q., Cen, Z., Chen, J., Xie, Y., Tang, H., & Yang, D. (2025). Investigation on the Interfacial Delamination of Glass Substrate Packaging Using Cohesive Zone Models. Micromachines, 16(8), 944. https://doi.org/10.3390/mi16080944