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Journal: Micromachines, 2025
Volume: 16
Number: 925

Article: Laser-Based Selective Removal of EMI Shielding Layers in System-in-Package (SiP) Modules
Authors: by Xuan-Bach Le, Won Yong Choi, Keejun Han and Sung-Hoon Choa
Link: https://www.mdpi.com/2072-666X/16/8/925

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