Ning, Y.; Li, L.; Wei, P.; Ke, S.; Zhu, W.; Nie, X.; He, D.; Liu, M.; Zhao, W.
Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation. Micromachines 2025, 16, 648.
https://doi.org/10.3390/mi16060648
AMA Style
Ning Y, Li L, Wei P, Ke S, Zhu W, Nie X, He D, Liu M, Zhao W.
Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation. Micromachines. 2025; 16(6):648.
https://doi.org/10.3390/mi16060648
Chicago/Turabian Style
Ning, Yu, Longzhou Li, Ping Wei, Shaoqiu Ke, Wanting Zhu, Xiaolei Nie, Danqi He, Mingrui Liu, and Wenyu Zhao.
2025. "Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation" Micromachines 16, no. 6: 648.
https://doi.org/10.3390/mi16060648
APA Style
Ning, Y., Li, L., Wei, P., Ke, S., Zhu, W., Nie, X., He, D., Liu, M., & Zhao, W.
(2025). Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation. Micromachines, 16(6), 648.
https://doi.org/10.3390/mi16060648
