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Journal: Micromachines, 2025
Volume: 16
Number: 582
582
Article: Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing
Authors: by Xianglong Chu, Shitao Wang, Chunlei Li, Zhizhen Wang, Shenglin Ma, Daowei Wu, Hai Yuan and Bin You
Link: https://www.mdpi.com/2072-666X/16/5/582

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