Ding, Z.; Liu, S.; Lin, C.; Zheng, T.; Xu, L.; Hu, Q.; Shi, T.; Li, L.
Study on Stress Distribution and Its Impact on Reliability of SiO2-Based Inorganic Chiplet Gap Filling. Micromachines 2025, 16, 1310.
https://doi.org/10.3390/mi16121310
AMA Style
Ding Z, Liu S, Lin C, Zheng T, Xu L, Hu Q, Shi T, Li L.
Study on Stress Distribution and Its Impact on Reliability of SiO2-Based Inorganic Chiplet Gap Filling. Micromachines. 2025; 16(12):1310.
https://doi.org/10.3390/mi16121310
Chicago/Turabian Style
Ding, Ziyang, Shaowei Liu, Chen Lin, Tianze Zheng, Lihui Xu, Qiuhan Hu, Tailong Shi, and Liyi Li.
2025. "Study on Stress Distribution and Its Impact on Reliability of SiO2-Based Inorganic Chiplet Gap Filling" Micromachines 16, no. 12: 1310.
https://doi.org/10.3390/mi16121310
APA Style
Ding, Z., Liu, S., Lin, C., Zheng, T., Xu, L., Hu, Q., Shi, T., & Li, L.
(2025). Study on Stress Distribution and Its Impact on Reliability of SiO2-Based Inorganic Chiplet Gap Filling. Micromachines, 16(12), 1310.
https://doi.org/10.3390/mi16121310
