Li, P.; Huang, J.; Zhang, J.; Gong, H.; Wang, J.; Zuo, D.; Su, M.; Shi, J.
Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines 2025, 16, 1292.
https://doi.org/10.3390/mi16111292
AMA Style
Li P, Huang J, Zhang J, Gong H, Wang J, Zuo D, Su M, Shi J.
Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines. 2025; 16(11):1292.
https://doi.org/10.3390/mi16111292
Chicago/Turabian Style
Li, Pan, Jin Huang, Jie Zhang, Hongxiao Gong, Jianjun Wang, Daijiang Zuo, Mengyang Su, and Jiwei Shi.
2025. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis" Micromachines 16, no. 11: 1292.
https://doi.org/10.3390/mi16111292
APA Style
Li, P., Huang, J., Zhang, J., Gong, H., Wang, J., Zuo, D., Su, M., & Shi, J.
(2025). Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines, 16(11), 1292.
https://doi.org/10.3390/mi16111292
