Next Article in Journal
Ultrasonic Vibration-Assisted Micro-Electrical Discharge Machining Characteristics and Parameter Optimization of C/SiC Composites
Next Article in Special Issue
Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding
Previous Article in Journal
Development and Validation of a Multimodal Wearable Belt for Abdominal Biosignal Monitoring with Application to Irritable Bowel Syndrome
Previous Article in Special Issue
SPICE-Compatible Degradation Modeling Framework for TDDB and LER Effects in Advanced Packaging BEOL Based on Ion Migration Mechanism
 
 

Order Article Reprints

Journal: Micromachines, 2025
Volume: 16
Number: 1256

Article: Numerical Investigation of Crack Suppression Strategies in Ultra-Thin Glass Substrates for Advanced Packaging
Authors: by Xuan-Bach Le, Kee-Youn Yoo and Sung-Hoon Choa
Link: https://www.mdpi.com/2072-666X/16/11/1256

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop