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Micromachines2025, 16(10), 1155;https://doi.org/10.3390/mi16101155 
(registering DOI)
Journal: MicromachinesVolume: 16Number: 1155
Article: Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages
  • Authors:
  • Dinesh Kumar Kumaravel1,
  • Shinoj Sridharan Nair1 and
  • Khanh Tuyet Anh Tran1
  • et al.
Link: https://www.mdpi.com/2072-666X/16/10/1155

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