Li, H.; Chen, T.; Bie, W.; Chen, F.; Suo, Y.; Duan, Z.
Multi-Step Two-Dimensional Ultrasonic-Assisted Grinding of Silicon Carbide: An Experimental Study on Surface Topography and Roughness. Micromachines 2024, 15, 915.
https://doi.org/10.3390/mi15070915
AMA Style
Li H, Chen T, Bie W, Chen F, Suo Y, Duan Z.
Multi-Step Two-Dimensional Ultrasonic-Assisted Grinding of Silicon Carbide: An Experimental Study on Surface Topography and Roughness. Micromachines. 2024; 15(7):915.
https://doi.org/10.3390/mi15070915
Chicago/Turabian Style
Li, Hongbo, Tao Chen, Wenbo Bie, Fan Chen, Yuhao Suo, and Zhenyan Duan.
2024. "Multi-Step Two-Dimensional Ultrasonic-Assisted Grinding of Silicon Carbide: An Experimental Study on Surface Topography and Roughness" Micromachines 15, no. 7: 915.
https://doi.org/10.3390/mi15070915
APA Style
Li, H., Chen, T., Bie, W., Chen, F., Suo, Y., & Duan, Z.
(2024). Multi-Step Two-Dimensional Ultrasonic-Assisted Grinding of Silicon Carbide: An Experimental Study on Surface Topography and Roughness. Micromachines, 15(7), 915.
https://doi.org/10.3390/mi15070915